TP520用于倒装芯片的超高精度贴片生产工艺，具有自动上下料及自动贴片功能，并具备高精度的视觉定位机构及高灵敏度的压力控制机构。
The TP520 is applied to ultra-high precision die bonding production process for flip chips. It is equipped with automatic loading & unloading and automatic die attaching functions, as well as high-precision visual positioning mechanism and high-sensitivity pressure control mechanism.
可对芯片上的目标位置进行精准识别与定位，将贴片位置偏差控制在极小的微米级范围内，实现高精度、高稳定性的贴片效果，适合存储、逻辑、模拟等芯片的高速高精度生产。
It can accurately identify and locate target positions on chips, keeping placement deviation within minimal micron level, and achieving die bonding with high precision and superior stability. It is ideal for high-speed and high-precision production of memory, logic, analog and other types of chips.