全自动智能共晶贴片机—光通信版 TP300 Pro(Fully Automatic Intelligent Eutectic Bonder—Optical communication version)

  • 产品详情
  • 产品参数

贴片精度 Patch precision±2@3σμm

贴片效率 Patch efficiency20-24s/片

单管缺陷检测:四面缺陷检测,P面、N面、AR面、HR面

Single-pipe defect detection: four-side defect detection, P-side, N-side, AR-side, HR-side

贴片成品检测:支持四面检测、端面焊料效果检测、芯片露头尺寸测量

Finished product inspection: support for four-side inspection, end-solder effect detection, chip exposure size measurement

检测精度 Detecting Precision
±2μm@3σ
检出率 Detection Rate
≥ 99.8%
设备外形尺寸 External Dimensions
2000mm×1240mm×2100mm
设备总质量 Total Equipment Mass
约2000kg
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